draft-pan-transparent-ordered-bonding · Transparent Ordered Bonding for High-Capacity WAN Links

{
  "id": "draft-pan-transparent-ordered-bonding",
  "revision": "00",
  "title_en": "Transparent Ordered Bonding for High-Capacity WAN Links",
  "availability": "Active",
  "iesg_state": "I-D Exists",
  "revision_date": "2026-07-06",
  "group": "",
  "area": "",
  "responsible_ad": "",
  "intended_status": "",
  "last_call_end": "",
  "formats": [
    ".html",
    ".txt",
    ".xml"
  ],
  "authors": "潘昊宇 <panhaoyu@chinamobile.com>, Ruifeng Li <liruifengyjy@chinamobile.com>",
  "shepherd": "",
  "maturity_band": "uncertain",
  "maturity_ru": "Неопределённая зрелость",
  "maturity_basis_ru": [
    "Официальное состояние IESG: I-D Exists"
  ],
  "is_guarantee": false,
  "links": {
    "datatracker": "https://datatracker.ietf.org/doc/draft-pan-transparent-ordered-bonding/",
    "text": "https://www.ietf.org/archive/id/draft-pan-transparent-ordered-bonding-00.txt"
  }
}