⌕ Поиск по атласу

NIST · ИТ · 129f6d5a650612c6df02

129f6d5a650612c6df02 · Electrical Methods for Mechanical Characterization of Interconnect Thin Films

Electrical Methods for Mechanical Characterization of Interconnect Thin Films

We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in the

Официальный источник · 2005-09-01

Полные импортированные сведения карточки
{
  "title_en": "Electrical Methods for Mechanical Characterization of Interconnect Thin Films",
  "designation": "",
  "series": "",
  "status": "",
  "date": "2005-09-01",
  "date_original": "September 1, 2005",
  "url": "https://www.nist.gov/publications/electrical-methods-mechanical-characterization-interconnect-thin-films",
  "source": "NIST Publications",
  "display_en": "",
  "authors_en": "Robert Keller , Cynthia A. Volkert, Roy H. Geiss , Andrew Slifka , David T. Read , Nicholas Barbosa , Reiner Monig",
  "abstract_excerpt_en": "We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in the",
  "id": "129f6d5a650612c6df02",
  "sources": [
    "NIST Publications"
  ],
  "source_records": [
    {
      "title_en": "Electrical Methods for Mechanical Characterization of Interconnect Thin Films",
      "designation": "",
      "series": "",
      "status": "",
      "date": "2005-09-01",
      "date_original": "September 1, 2005",
      "url": "https://www.nist.gov/publications/electrical-methods-mechanical-characterization-interconnect-thin-films",
      "source": "NIST Publications",
      "display_en": "",
      "authors_en": "Robert Keller , Cynthia A. Volkert, Roy H. Geiss , Andrew Slifka , David T. Read , Nicholas Barbosa , Reiner Monig",
      "abstract_excerpt_en": "We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in the"
    }
  ],
  "translation_state": "none"
}