NIST · ИТ · 366b9338652bc1f7bacb
Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects
We demonstrate by use of automated electron backscatter diffraction (EBSD) the rapid growth of grains in non-passivated, sputtered Al-1Si interconnects during 200 Hz thermal cycling induced by alternating electric current. Mean grain diameters were
NIST · ИТОфициальный источник · 2007-01-01
{
"title_en": "Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects",
"designation": "",
"series": "",
"status": "",
"date": "2007-01-01",
"date_original": "January 1, 2007",
"url": "https://www.nist.gov/publications/strain-induced-grain-growth-during-rapid-thermal-cycling-aluminum-interconnects",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Robert Keller , Roy H. Geiss , Nicholas Barbosa , Andrew Slifka , David T. Read",
"abstract_excerpt_en": "We demonstrate by use of automated electron backscatter diffraction (EBSD) the rapid growth of grains in non-passivated, sputtered Al-1Si interconnects during 200 Hz thermal cycling induced by alternating electric current. Mean grain diameters were",
"id": "366b9338652bc1f7bacb",
"sources": [
"NIST Publications"
],
"source_records": [
{
"title_en": "Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects",
"designation": "",
"series": "",
"status": "",
"date": "2007-01-01",
"date_original": "January 1, 2007",
"url": "https://www.nist.gov/publications/strain-induced-grain-growth-during-rapid-thermal-cycling-aluminum-interconnects",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Robert Keller , Roy H. Geiss , Nicholas Barbosa , Andrew Slifka , David T. Read",
"abstract_excerpt_en": "We demonstrate by use of automated electron backscatter diffraction (EBSD) the rapid growth of grains in non-passivated, sputtered Al-1Si interconnects during 200 Hz thermal cycling induced by alternating electric current. Mean grain diameters were"
}
],
"translation_state": "none"
}