NIST · ИТ · 4869107b0b8e424ca373
Microstructure Evolution during Alternating-Current-lnduced Fatigue
Subjecting electronic interconnect lines to high-density, low.frequency alternating current creates cyclic thermomechanical stresses that eventually cause electrical failure. A detailed understanding of the failure process could contribute to both
NIST · ИТОфициальный источник · 2004-11-01
{
"title_en": "Microstructure Evolution during Alternating-Current-lnduced Fatigue",
"designation": "",
"series": "",
"status": "",
"date": "2004-11-01",
"date_original": "November 1, 2004",
"url": "https://www.nist.gov/publications/microstructure-evolution-during-alternating-current-lnduced-fatigue",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Robert Keller , Roy H. Geiss , Yi-Wen Cheng , David T. Read",
"abstract_excerpt_en": "Subjecting electronic interconnect lines to high-density, low.frequency alternating current creates cyclic thermomechanical stresses that eventually cause electrical failure. A detailed understanding of the failure process could contribute to both",
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{
"title_en": "Microstructure Evolution during Alternating-Current-lnduced Fatigue",
"designation": "",
"series": "",
"status": "",
"date": "2004-11-01",
"date_original": "November 1, 2004",
"url": "https://www.nist.gov/publications/microstructure-evolution-during-alternating-current-lnduced-fatigue",
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"display_en": "",
"authors_en": "Robert Keller , Roy H. Geiss , Yi-Wen Cheng , David T. Read",
"abstract_excerpt_en": "Subjecting electronic interconnect lines to high-density, low.frequency alternating current creates cyclic thermomechanical stresses that eventually cause electrical failure. A detailed understanding of the failure process could contribute to both"
}
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