NIST · ИТ · 678dc4286e9cc4875d09
Security Advantages and Challenges of 3D Heterogenous Integration
Three-dimensional heterogeneous integration offers compelling opportunities to enhance the security and trust in the current semiconductor chain while new attack surfaces may emerge.
NIST · ИТОфициальный источник · 2024-03-06
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"title_en": "Security Advantages and Challenges of 3D Heterogenous Integration",
"designation": "",
"series": "",
"status": "",
"date": "2024-03-06",
"date_original": "March 6, 2024",
"url": "https://www.nist.gov/publications/security-advantages-and-challenges-3d-heterogenous-integration",
"source": "NIST Publications",
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"authors_en": "Yuntao Liu, Daniel Xing, Isaac McDaniel, Olsan Ozbay, Abir Ahsan Akib, Mumtahina Islam Sukanya, Sanjay (Jay) Rekhi , Ankur Srivastava",
"abstract_excerpt_en": "Three-dimensional heterogeneous integration offers compelling opportunities to enhance the security and trust in the current semiconductor chain while new attack surfaces may emerge.",
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{
"title_en": "Security Advantages and Challenges of 3D Heterogenous Integration",
"designation": "",
"series": "",
"status": "",
"date": "2024-03-06",
"date_original": "March 6, 2024",
"url": "https://www.nist.gov/publications/security-advantages-and-challenges-3d-heterogenous-integration",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Yuntao Liu, Daniel Xing, Isaac McDaniel, Olsan Ozbay, Abir Ahsan Akib, Mumtahina Islam Sukanya, Sanjay (Jay) Rekhi , Ankur Srivastava",
"abstract_excerpt_en": "Three-dimensional heterogeneous integration offers compelling opportunities to enhance the security and trust in the current semiconductor chain while new attack surfaces may emerge."
}
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