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6c232c8490c3e4f63124 · Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules

Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules

Thermal component models are developed for multi-chip IGBT power electronic modules (PEM) and associated high-power converter heatsinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate the

Официальный источник · 2002-10-24

Полные импортированные сведения карточки
{
  "title_en": "Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules",
  "designation": "",
  "series": "",
  "status": "",
  "date": "2002-10-24",
  "date_original": "October 24, 2002",
  "url": "https://www.nist.gov/publications/thermal-component-models-electro-thermal-analysis-multichip-power-modules",
  "source": "NIST Publications",
  "display_en": "",
  "authors_en": "J J. Rodriguez, John V. Reichl , Zharadeen R. Parrilla, Allen R. Hefner Jr. , David W. Berning , M Velez-Reyes, Jih-Sheng Lai",
  "abstract_excerpt_en": "Thermal component models are developed for multi-chip IGBT power electronic modules (PEM) and associated high-power converter heatsinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate the",
  "id": "6c232c8490c3e4f63124",
  "sources": [
    "NIST Publications"
  ],
  "source_records": [
    {
      "title_en": "Thermal Component Models for Electro-Thermal Analysis of Multichip Power Modules",
      "designation": "",
      "series": "",
      "status": "",
      "date": "2002-10-24",
      "date_original": "October 24, 2002",
      "url": "https://www.nist.gov/publications/thermal-component-models-electro-thermal-analysis-multichip-power-modules",
      "source": "NIST Publications",
      "display_en": "",
      "authors_en": "J J. Rodriguez, John V. Reichl , Zharadeen R. Parrilla, Allen R. Hefner Jr. , David W. Berning , M Velez-Reyes, Jih-Sheng Lai",
      "abstract_excerpt_en": "Thermal component models are developed for multi-chip IGBT power electronic modules (PEM) and associated high-power converter heatsinks. The models are implemented in SABER and are combined with the electro-thermal IGBT and diode models to simulate the"
    }
  ],
  "translation_state": "none"
}