NIST · ИТ · 773a3629fdcb8fb692a6
Electric Current Induced Thermomechanical Fatigue Testing of Interconnects
We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current density
NIST · ИТОфициальный источник · 2005-03-01
{
"title_en": "Electric Current Induced Thermomechanical Fatigue Testing of Interconnects",
"designation": "",
"series": "",
"status": "",
"date": "2005-03-01",
"date_original": "March 1, 2005",
"url": "https://www.nist.gov/publications/electric-current-induced-thermomechanical-fatigue-testing-interconnects",
"source": "NIST Publications",
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"authors_en": "Robert Keller , Roy H. Geiss , Yi-Wen Cheng , David T. Read",
"abstract_excerpt_en": "We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current density",
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{
"title_en": "Electric Current Induced Thermomechanical Fatigue Testing of Interconnects",
"designation": "",
"series": "",
"status": "",
"date": "2005-03-01",
"date_original": "March 1, 2005",
"url": "https://www.nist.gov/publications/electric-current-induced-thermomechanical-fatigue-testing-interconnects",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Robert Keller , Roy H. Geiss , Yi-Wen Cheng , David T. Read",
"abstract_excerpt_en": "We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current density"
}
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}