NIST · ИТ · 7a4d04c34670925be9fd
Experimentally, How Does Cu TSV Diameter Influence its Stress State?
In this work, an experimental study of the influence of Cu through-silicon via (TSV) diameter on stress build up was performed using synchrotron-based X-ray microdiffraction technique. Three Cu TSV diameters were studied; 3 µm, 5 µm and 8 µm, all of which
NIST · ИТОфициальный источник · 2015-05-27
{
"title_en": "Experimentally, How Does Cu TSV Diameter Influence its Stress State?",
"designation": "",
"series": "",
"status": "",
"date": "2015-05-27",
"date_original": "May 27, 2015",
"url": "https://www.nist.gov/publications/experimentally-how-does-cu-tsv-diameter-influence-its-stress-state",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Chukwudi A. Okoro , Lyle E. Levine , Yaw S. Obeng , Ruqing Xu",
"abstract_excerpt_en": "In this work, an experimental study of the influence of Cu through-silicon via (TSV) diameter on stress build up was performed using synchrotron-based X-ray microdiffraction technique. Three Cu TSV diameters were studied; 3 µm, 5 µm and 8 µm, all of which",
"id": "7a4d04c34670925be9fd",
"sources": [
"NIST Publications"
],
"source_records": [
{
"title_en": "Experimentally, How Does Cu TSV Diameter Influence its Stress State?",
"designation": "",
"series": "",
"status": "",
"date": "2015-05-27",
"date_original": "May 27, 2015",
"url": "https://www.nist.gov/publications/experimentally-how-does-cu-tsv-diameter-influence-its-stress-state",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Chukwudi A. Okoro , Lyle E. Levine , Yaw S. Obeng , Ruqing Xu",
"abstract_excerpt_en": "In this work, an experimental study of the influence of Cu through-silicon via (TSV) diameter on stress build up was performed using synchrotron-based X-ray microdiffraction technique. Three Cu TSV diameters were studied; 3 µm, 5 µm and 8 µm, all of which"
}
],
"translation_state": "none"
}