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85d083be7ccbb92afd8e · Measuring Out-of-Plane Permittivity of Thin Films to Millimeter Wave Frequencies

Measuring Out-of-Plane Permittivity of Thin Films to Millimeter Wave Frequencies

Modern microchips utilize multilayer stack-ups with many interstitial layers of dielectrics. Optimizing device performance and maximizing yield requires precise measurements of the out-of-plane permittivity of these dielectric layers. At the same time

Официальный источник · 2025-04-22

Полные импортированные сведения карточки
{
  "title_en": "Measuring Out-of-Plane Permittivity of Thin Films to Millimeter Wave Frequencies",
  "designation": "",
  "series": "",
  "status": "",
  "date": "2025-04-22",
  "date_original": "April 22, 2025",
  "url": "https://www.nist.gov/publications/measuring-out-plane-permittivity-thin-films-millimeter-wave-frequencies",
  "source": "NIST Publications",
  "display_en": "",
  "authors_en": "Florian Bergmann , Meagan Papac, Benjamin Jamroz , Nicholas Jungwirth , Bryan Bosworth , Anna Osella , Tomasz Karpisz , Lucas Enright , Eric Marksz, Angela Stelson , Christian Long , Nathan Orloff , Robert Jones",
  "abstract_excerpt_en": "Modern microchips utilize multilayer stack-ups with many interstitial layers of dielectrics. Optimizing device performance and maximizing yield requires precise measurements of the out-of-plane permittivity of these dielectric layers. At the same time",
  "id": "85d083be7ccbb92afd8e",
  "sources": [
    "NIST Publications"
  ],
  "source_records": [
    {
      "title_en": "Measuring Out-of-Plane Permittivity of Thin Films to Millimeter Wave Frequencies",
      "designation": "",
      "series": "",
      "status": "",
      "date": "2025-04-22",
      "date_original": "April 22, 2025",
      "url": "https://www.nist.gov/publications/measuring-out-plane-permittivity-thin-films-millimeter-wave-frequencies",
      "source": "NIST Publications",
      "display_en": "",
      "authors_en": "Florian Bergmann , Meagan Papac, Benjamin Jamroz , Nicholas Jungwirth , Bryan Bosworth , Anna Osella , Tomasz Karpisz , Lucas Enright , Eric Marksz, Angela Stelson , Christian Long , Nathan Orloff , Robert Jones",
      "abstract_excerpt_en": "Modern microchips utilize multilayer stack-ups with many interstitial layers of dielectrics. Optimizing device performance and maximizing yield requires precise measurements of the out-of-plane permittivity of these dielectric layers. At the same time"
    }
  ],
  "translation_state": "none"
}