85d083be7ccbb92afd8e · Measuring Out-of-Plane Permittivity of Thin Films to Millimeter Wave Frequencies
Measuring Out-of-Plane Permittivity of Thin Films to Millimeter Wave Frequencies
Modern microchips utilize multilayer stack-ups with many interstitial layers of dielectrics. Optimizing device performance and maximizing yield requires precise measurements of the out-of-plane permittivity of these dielectric layers. At the same time
{
"title_en": "Measuring Out-of-Plane Permittivity of Thin Films to Millimeter Wave Frequencies",
"designation": "",
"series": "",
"status": "",
"date": "2025-04-22",
"date_original": "April 22, 2025",
"url": "https://www.nist.gov/publications/measuring-out-plane-permittivity-thin-films-millimeter-wave-frequencies",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Florian Bergmann , Meagan Papac, Benjamin Jamroz , Nicholas Jungwirth , Bryan Bosworth , Anna Osella , Tomasz Karpisz , Lucas Enright , Eric Marksz, Angela Stelson , Christian Long , Nathan Orloff , Robert Jones",
"abstract_excerpt_en": "Modern microchips utilize multilayer stack-ups with many interstitial layers of dielectrics. Optimizing device performance and maximizing yield requires precise measurements of the out-of-plane permittivity of these dielectric layers. At the same time",
"id": "85d083be7ccbb92afd8e",
"sources": [
"NIST Publications"
],
"source_records": [
{
"title_en": "Measuring Out-of-Plane Permittivity of Thin Films to Millimeter Wave Frequencies",
"designation": "",
"series": "",
"status": "",
"date": "2025-04-22",
"date_original": "April 22, 2025",
"url": "https://www.nist.gov/publications/measuring-out-plane-permittivity-thin-films-millimeter-wave-frequencies",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Florian Bergmann , Meagan Papac, Benjamin Jamroz , Nicholas Jungwirth , Bryan Bosworth , Anna Osella , Tomasz Karpisz , Lucas Enright , Eric Marksz, Angela Stelson , Christian Long , Nathan Orloff , Robert Jones",
"abstract_excerpt_en": "Modern microchips utilize multilayer stack-ups with many interstitial layers of dielectrics. Optimizing device performance and maximizing yield requires precise measurements of the out-of-plane permittivity of these dielectric layers. At the same time"
}
],
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}