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864a426430bf4843a8f2 · Nanoelectronic Fabrication with Flip Chip Lamination

Nanoelectronic Fabrication with Flip Chip Lamination

Nanoelectronic fabrication with Flip chip lamination Mariona Coll, CA Richter, CA Hacker, Colloquium Catalan Institute of Nanoscience and Nanotechnology CIN2, Barcelona Spain, Dec 2009.

Официальный источник · 2009-12-15

Полные импортированные сведения карточки
{
  "title_en": "Nanoelectronic Fabrication with Flip Chip Lamination",
  "designation": "",
  "series": "",
  "status": "",
  "date": "2009-12-15",
  "date_original": "December 15, 2009",
  "url": "https://www.nist.gov/publications/nanoelectronic-fabrication-flip-chip-lamination",
  "source": "NIST Publications",
  "display_en": "",
  "authors_en": "Mariona Coll Bau , Curt Richter , Christina Hacker",
  "abstract_excerpt_en": "Nanoelectronic fabrication with Flip chip lamination Mariona Coll, CA Richter, CA Hacker, Colloquium Catalan Institute of Nanoscience and Nanotechnology CIN2, Barcelona Spain, Dec 2009.",
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  "sources": [
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    {
      "title_en": "Nanoelectronic Fabrication with Flip Chip Lamination",
      "designation": "",
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      "date": "2009-12-15",
      "date_original": "December 15, 2009",
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      "authors_en": "Mariona Coll Bau , Curt Richter , Christina Hacker",
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