NIST · ИТ · 9692964fdce1f58e1a9b
Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects
We demonstrate the evolution of microstructure and deformation associated with the use of electrical methods for evaluating mechanical reliability of patterned interconnects on rigid substrates. Thermomechanical fatigue in aluminum and copper interconnects
NIST · ИТОфициальный источник · 2005-04-01
{
"title_en": "Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects",
"designation": "",
"series": "",
"status": "",
"date": "2005-04-01",
"date_original": "April 1, 2005",
"url": "https://www.nist.gov/publications/microstructure-evolution-during-electric-current-induced-thermomechanical-fatigue",
"source": "NIST Publications",
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"authors_en": "Robert Keller , Roy H. Geiss , Yi-Wen Cheng , David T. Read",
"abstract_excerpt_en": "We demonstrate the evolution of microstructure and deformation associated with the use of electrical methods for evaluating mechanical reliability of patterned interconnects on rigid substrates. Thermomechanical fatigue in aluminum and copper interconnects",
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{
"title_en": "Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects",
"designation": "",
"series": "",
"status": "",
"date": "2005-04-01",
"date_original": "April 1, 2005",
"url": "https://www.nist.gov/publications/microstructure-evolution-during-electric-current-induced-thermomechanical-fatigue",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Robert Keller , Roy H. Geiss , Yi-Wen Cheng , David T. Read",
"abstract_excerpt_en": "We demonstrate the evolution of microstructure and deformation associated with the use of electrical methods for evaluating mechanical reliability of patterned interconnects on rigid substrates. Thermomechanical fatigue in aluminum and copper interconnects"
}
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}