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aeaa2716f912265e3dac · Compensation of Thermal Expansiveness In Plastic DCA-Flip-Chip Assemblies Using A Mechanically Compliant Dielectric

Compensation of Thermal Expansiveness In Plastic DCA-Flip-Chip Assemblies Using A Mechanically Compliant Dielectric

Application of a compliant, low modulus dielectric layer between the chip joints (C4) and the carrier can decrease the thermally induced bending and probability of failure. Model analysis and experimental data indicate that the optimal thickness of the

Официальный источник · 1999-05-03

Полные импортированные сведения карточки
{
  "title_en": "Compensation of Thermal Expansiveness In Plastic DCA-Flip-Chip Assemblies Using A Mechanically Compliant Dielectric",
  "designation": "",
  "series": "",
  "status": "",
  "date": "1999-05-03",
  "date_original": "May 3, 1999",
  "url": "https://www.nist.gov/publications/compensation-thermal-expansiveness-plastic-dca-flip-chip-assemblies-using-mechanically",
  "source": "NIST Publications",
  "display_en": "",
  "authors_en": "Jan Obrzut",
  "abstract_excerpt_en": "Application of a compliant, low modulus dielectric layer between the chip joints (C4) and the carrier can decrease the thermally induced bending and probability of failure. Model analysis and experimental data indicate that the optimal thickness of the",
  "id": "aeaa2716f912265e3dac",
  "sources": [
    "NIST Publications"
  ],
  "source_records": [
    {
      "title_en": "Compensation of Thermal Expansiveness In Plastic DCA-Flip-Chip Assemblies Using A Mechanically Compliant Dielectric",
      "designation": "",
      "series": "",
      "status": "",
      "date": "1999-05-03",
      "date_original": "May 3, 1999",
      "url": "https://www.nist.gov/publications/compensation-thermal-expansiveness-plastic-dca-flip-chip-assemblies-using-mechanically",
      "source": "NIST Publications",
      "display_en": "",
      "authors_en": "Jan Obrzut",
      "abstract_excerpt_en": "Application of a compliant, low modulus dielectric layer between the chip joints (C4) and the carrier can decrease the thermally induced bending and probability of failure. Model analysis and experimental data indicate that the optimal thickness of the"
    }
  ],
  "translation_state": "none"
}