NIST · ИТ · e12539640273c181e17b
A High-Speed Thermal Imaging System for Semiconductor Device Analysis
A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument
NIST · ИТОфициальный источник · 2001-04-01
{
"title_en": "A High-Speed Thermal Imaging System for Semiconductor Device Analysis",
"designation": "",
"series": "",
"status": "",
"date": "2001-04-01",
"date_original": "April 1, 2001",
"url": "https://www.nist.gov/publications/high-speed-thermal-imaging-system-semiconductor-device-analysis",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Allen R. Hefner Jr. , David W. Berning , David L. Blackburn , Christophe C. Chapuy , Sebastien Bouche",
"abstract_excerpt_en": "A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument",
"id": "e12539640273c181e17b",
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{
"title_en": "A High-Speed Thermal Imaging System for Semiconductor Device Analysis",
"designation": "",
"series": "",
"status": "",
"date": "2001-04-01",
"date_original": "April 1, 2001",
"url": "https://www.nist.gov/publications/high-speed-thermal-imaging-system-semiconductor-device-analysis",
"source": "NIST Publications",
"display_en": "",
"authors_en": "Allen R. Hefner Jr. , David W. Berning , David L. Blackburn , Christophe C. Chapuy , Sebastien Bouche",
"abstract_excerpt_en": "A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument"
}
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}