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f10d618a47bed17e9f66 · Resistivity Dominated by Surface Scattering in Sub-50 nm Cu Wires

Resistivity Dominated by Surface Scattering in Sub-50 nm Cu Wires

The electron scattering mechanisms in sub-50nm copper lines were investigated to understand the extendibility of copper interconnects when the line width or thickness is less than the mean free path. Electron-beam lithography and a dual hardmask approach

Официальный источник · 2010-01-25

Полные импортированные сведения карточки
{
  "title_en": "Resistivity Dominated by Surface Scattering in Sub-50 nm Cu Wires",
  "designation": "",
  "series": "",
  "status": "",
  "date": "2010-01-25",
  "date_original": "January 25, 2010",
  "url": "https://www.nist.gov/publications/resistivity-dominated-surface-scattering-sub-50-nm-cu-wires",
  "source": "NIST Publications",
  "display_en": "",
  "authors_en": "Rebekah L. Graham, Glenn Alers, Thomas Mountsier, N. Shamma, S. Dhuey, R. H. Cabrini, Roy H. Geiss , David T. Read , S. Peddeti",
  "abstract_excerpt_en": "The electron scattering mechanisms in sub-50nm copper lines were investigated to understand the extendibility of copper interconnects when the line width or thickness is less than the mean free path. Electron-beam lithography and a dual hardmask approach",
  "id": "f10d618a47bed17e9f66",
  "sources": [
    "NIST Publications"
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  "source_records": [
    {
      "title_en": "Resistivity Dominated by Surface Scattering in Sub-50 nm Cu Wires",
      "designation": "",
      "series": "",
      "status": "",
      "date": "2010-01-25",
      "date_original": "January 25, 2010",
      "url": "https://www.nist.gov/publications/resistivity-dominated-surface-scattering-sub-50-nm-cu-wires",
      "source": "NIST Publications",
      "display_en": "",
      "authors_en": "Rebekah L. Graham, Glenn Alers, Thomas Mountsier, N. Shamma, S. Dhuey, R. H. Cabrini, Roy H. Geiss , David T. Read , S. Peddeti",
      "abstract_excerpt_en": "The electron scattering mechanisms in sub-50nm copper lines were investigated to understand the extendibility of copper interconnects when the line width or thickness is less than the mean free path. Electron-beam lithography and a dual hardmask approach"
    }
  ],
  "translation_state": "none"
}