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NIST · ИТ · f98a8614670dab59284a

f98a8614670dab59284a · Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films

Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films

Effects of the chemistry of electroplated copper films on stress-induced voiding and adhesion between the films and a SiN barrier layer are reported. The void density as observed by scanning electron microscopy decreased markedly with increasing Cu purity

Официальный источник · 2009-10-13

Полные импортированные сведения карточки
{
  "title_en": "Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films",
  "designation": "",
  "series": "",
  "status": "",
  "date": "2009-10-13",
  "date_original": "October 13, 2009",
  "url": "https://www.nist.gov/publications/adhesion-copper-voiding-and-debonding-kinetics-copperdielectric-diffusion-barrier-films",
  "source": "NIST Publications",
  "display_en": "",
  "authors_en": "Ryan P. Birringer, Roey Shaviv, Thomas Mountsier, Jon Reid, Jian Zhou, Roy H. Geiss , David T. Read , Reinhold Dauskardt",
  "abstract_excerpt_en": "Effects of the chemistry of electroplated copper films on stress-induced voiding and adhesion between the films and a SiN barrier layer are reported. The void density as observed by scanning electron microscopy decreased markedly with increasing Cu purity",
  "id": "f98a8614670dab59284a",
  "sources": [
    "NIST Publications"
  ],
  "source_records": [
    {
      "title_en": "Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films",
      "designation": "",
      "series": "",
      "status": "",
      "date": "2009-10-13",
      "date_original": "October 13, 2009",
      "url": "https://www.nist.gov/publications/adhesion-copper-voiding-and-debonding-kinetics-copperdielectric-diffusion-barrier-films",
      "source": "NIST Publications",
      "display_en": "",
      "authors_en": "Ryan P. Birringer, Roey Shaviv, Thomas Mountsier, Jon Reid, Jian Zhou, Roy H. Geiss , David T. Read , Reinhold Dauskardt",
      "abstract_excerpt_en": "Effects of the chemistry of electroplated copper films on stress-induced voiding and adhesion between the films and a SiN barrier layer are reported. The void density as observed by scanning electron microscopy decreased markedly with increasing Cu purity"
    }
  ],
  "translation_state": "none"
}